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Aurrion Wins $13.9M Contract to Advance Electronic-Photonic Integration

Dépèche transmise le 28 novembre 2011 par Business Wire

Aurrion Wins $13.9M Contract to Advance Electronic-Photonic Integration

Aurrion Wins $13.9M Contract to Advance Electronic-Photonic Integration

GOLETA, Calif.--(BUSINESS WIRE)--Aurrion, Inc., a world leader in silicon photonics, announced that is has been awarded a $13.9 million Defense Advanced Research Projects Agency (DARPA) multi-year R&D contract through the Electronic-Photonic Heterogeneous Integration (E-PHI) program. Working in collaboration with the University of California at Santa Barbara, the California Institute of Technology, the University of Virginia, the University of Washington and Rockwell Collins, Inc., Aurrion will develop new technologies and architectures for electronic-photonic integrated circuits on a common silicon substrate.

“By combining the best photonic materials for the required functions closely integrated with electronics, we will demonstrate 3D chip scale systems that can achieve optical bench performance on a single silicon substrate”

Dr. Greg Fish, Aurrion’s Vice President of Research and the Principal Investigator, explained that the components developed in this program will not only meet the performance of native substrate devices but exceed them, leading to a dramatic enhancement in systems.

“E-PHI is enabling key More-than-Moore technologies. The key innovation is leveraging both CMOS and MEMS silicon processes to produce 3D heterogeneous electronic/photonic silicon circuits that use diverse materials for photonic components yet are still processed and interconnected at wafer scale,” Dr. Fish said.

Using established foundry infrastructure, the technologies developed in this program are expected to dramatically improve both the performance and cost of complex photonic systems in multiple markets such as optical sensors, next generation transceivers and high performance computing.

“By combining the best photonic materials for the required functions closely integrated with electronics, we will demonstrate 3D chip scale systems that can achieve optical bench performance on a single silicon substrate,” Dr. Fish said.

About Aurrion

Aurrion is a rapidly growing company based in Goleta, California. Aurrion’s platform enables all the elements of photonics systems, including active components such as lasers and amplifiers, to be fabricated on the wafer scale with the performance of traditional III-V materials and the control and cost-structure of silicon foundries. Aurrion is working with system integrators to produce the next generation of photonic systems that leverage the size, cost and power savings that are enabled by this platform.

Business Wire

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