Dépêches

Photo Stencil Poster "Stencil Design for Broadband Printing (Very Small and Normal Components on the same PCB)" Chosen Best of the Technical Conference at IPC APEX EXPO 2011

Dépèche transmise le 5 mai 2011 par Business Wire

Photo Stencil Poster "Stencil Design for Broadband Printing (Very Small and Normal Components on the same PCB)" Chosen Best of the Technical Conference at IPC APEX EXPO 2011

COLORADO SPRINGS, Colo.--(BUSINESS WIRE)--Photo Stencil, a leading full-service provider of high-performance stencils and tooling, announced that the poster presented by Dr. William Coleman, titled Stencil Design for Broadband Printing (Very Small and Normal Components on the same PCB), was chosen by the Technical Program Committee of IPC as "Best Poster of the Technical Conference" for the 2011 IPC APEX Expo, held April 12–14, 2011 in Las Vegas, NV. IPC–Association Connecting Electronics Industries^® celebrates the best of electronic interconnection research being conducted by both industry leaders and academia.

“You did a wonderful job with your poster”

The poster analyzes three stencil printing options for applying solder to boards that are populated with both very small pitch .4mm devices as well as larger pitch devices such as .5mm, .65mm, and 1mm. Normally the stencil should be at least 100 microns thick for normal devices to achieve acceptable solder fillets. However, at this thickness, the area ratio (solder paste ability to release from the stencil aperture) is well below the minimum acceptable value of .66 for most stencils and .50 for some special electroform stencils needed for these small devices. An aperture size of 175 microns in a 100 micron stencil is required for acceptable paste transfer for these very small devices.

As the poster demonstrated, testing showed that incorporating a nano-coating to an already smooth aperture wall surface of electroform and NicAlloy-XT stencils improves lubercisity of the wall surface to promote better paste transfer for the very small apertures associated with .4mm chip scale packages and 01005 devices.

"You did a wonderful job with your poster," wrote Toya S. Richardson, Technical Programs coordinator, IPC in a letter to William Coleman announcing the award. "This poster reflects extremely well upon you and Photo Stencil. All of the posters considered were very well done, so you should feel extremely proud that the committee selected your poster as 'Best' in the industry."

"We are honored that Bill's poster received this distinction," commented Neil MacRaild, president and CEO, Photo Stencil. "Bill has distinguished himself in the electronics industry. As an expert on stencils and printing technology, he has written and presented a multitude of papers and served on numerous panels, boards, and committees. We congratulate him on this recognition."

Photo available at http://bit.ly/l1NFgI

About Photo Stencil

Photo Stencil is a leading full-service provider of high-performance stencils, squeegee blades, thick film and metal mask screens, and tooling for the surface mount technology assembly, solar, and semiconductor industries. Its innovations include the patented AMTX E-FAB^® electroformed, high-performance, proprietary NicAlloy™, NicAlloy-XT™, laser-cut, and chemetch stencils, and patented electroformed E-Blade^® squeegee blade. Step or multi-level stencils are offered in all technologies. Stencil design support and customer-specific design libraries are also provided. Headquartered in Colorado Springs with manufacturing facilities in Mexico and Malaysia, Photo Stencil was founded in 1979. For more information, visit www.photostencil.com.