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Park Electrochemical Corp. Announces Appointment of William L. Pappani as Vice President of Business Development and Planning

Dépèche transmise le 20 septembre 2011 par Business Wire

Park Electrochemical Corp. Announces Appointment of William L. Pappani as Vice President of Business Development and Planning

MELVILLE, N.Y.--(BUSINESS WIRE)--Park Electrochemical Corp. (NYSE-PKE) announced the appointment of William L. Pappani as Vice President of Business Development and Planning for the Company. Mr. Pappani will report to Brian Shore, Park’s President and Chief Executive Officer.

Prior to joining Park Electrochemical Corp., Mr. Pappani was Vice President of Finance and Chief Financial Officer of Maskless Lithography, Inc., a designer and manufacturer of direct-write lithography production equipment for printed circuit board manufacturing, since January 2011. From October 2005 to November 2010, Mr. Pappani was Vice President of Finance and Division Controller of the PCB Division of Sanmina-SCI Corporation, an electronics contract manufacturing services company; and from February 1999 to September 2005, he was Division Controller of Sanmina-SCI’s PCB division. From January 1996 to January 1999, Mr. Pappani was Financial Controller of Ball Screws & Actuators Co., Inc., a manufacturer and distributor of linear motion devices for the semi-conductor and medical equipment industries. From July 1986 to August 1993, Mr. Pappani held various accounting and financial positions with OCE Graphics France and OCE Graphics USA. Mr. Pappani received a Bachelor of Science degree in Business Administration from San Jose State University, a Masters of Business Administration degree from International University of Japan in collaboration with The Amos Tuck School of Business Administration, Dartmouth College, and a Certificate in Information Systems Management from the University of California at Santa Cruz Extension.

Park Electrochemical Corp. is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. The Company’s manufacturing facilities are located in Singapore, China, France, Connecticut, Kansas, Arizona, California and Washington.

Additional corporate information is available on the Company’s web site at www.parkelectro.com.